Nova’s expertise in Thin Film and Optical CD & shape profiling metrology systems are addressing the complex measurement and process control challenges of High Volume Production (HVM) in 300 & 200 mm IC manufacturing, from 90nm to the demanding 45nm and 32nm technology nodes.

In the area of polishing, Nova offers comprehensive metrology solutions for Dielectric CMP, Copper CMP, and Poly Plug CMP, with a variety of Integrated and Stand-alone Metrology products.