Challenge:

As processes shrink to and below 65nm, accuracy requirements for thin film monitoring and control tighten significantly. And as the correlation between test structures and in-device parameters deteriorates, the need for in-die measurement capabilities increases. 

Solution:

Nova’s expertise in Thin Film and Optical CD and shape profiling metrology systems addresses the complex measurement and process control challenges of High Volume Manufacturing (HVM) in 300 and 200 mm IC manufacturing, from 90 nm to the demanding 45 and 32 nm technology nodes.  Nova provides both standalone and integrated thin film monitoring solutions, featuring the highest precision, fleet (tool-to-tool) matching, throughput and recipe compatibility. Based on patented normal incidence spectroscopic scatterometry and reflectometry, Nova’s metrology products enable measurements on blanket wafers, test sites and in-die films, down to 32 nm. Measurement of optical properties (n&k) enables chamber matching and qualification of CVD and PVD processes.